Sequans Introduces Mobile WiMAX Single Chip Solution Integrating Baseband, RF, and Memory

SEQUANS Communications, announced availability of its newest chip, the SQN1170, which integrates baseband, RF, and memory in a single chip. Sequans also announced that Mitsumi, leading system-in-package module maker, is the first to use the chip to develop an SDIO module comprising full Mobile WiMAX system functionality. The SDIO module offers manufacturers a complete and highly flexible solution to quickly build high performance, low power-consuming Mobile WiMAX end user devices. The SDIO module is the first of several modules Mitsumi is developing based on Sequans’ SQN1170. It will be on display at WiMAX World Europe, Sequans’ booth 411, May 20-21.

“We are very pleased to be working with Mitsumi,” said Georges Karam, Sequans CEO. “The high level of integration, small size, and total Mobile WiMAX system functionality of the SDIO module make it one of the most valuable solutions for WiMAX device makers in the market today.”

“Sequans has proven itself to be the leading WiMAX chipmaker with singular achievements in performance and power consumption,” said Susumu Kuribayashi, senior manager, Mitsumi Electric Co. “Our collaboration has yielded a superior module that will enable the manufacture of state-of-the-art Mobile WiMAX devices.”

The SQN1170 measures 12X12 mm² and delivers high throughput of more than 30 Mbps with very low power, consuming less than 600 mW total power in peak MIMO mode. The Mitsumi SDIO module measures a mere 400 mm², integrating with the SQN1170 all components necessary to deliver full Mobile WiMAX system functionality.

The SQN1170 can be used to build all types of mobile devices--from mobile phones to embedded PC applications to SDIO modules for consumer electronics devices. It also easily enables integrated combination designs such as WiFi/WiMAX half MiniCards with standard PCB and assembly technologies.

The SQN1170 is the sixth Mobile WiMAX chip Sequans has delivered, following a Mobile WiMAX Wave 1 chip in 2006, two baseband Mobile WiMAX Wave 2 chips in 2007 for base station and mobile stations and two RF chips (2.5 GHz and 3.5 GHz).